Description
As packaging technology advances and expands the scope of plastics application, we see a considerable number of blister-packed products in the market. A blister-pack approach represents a system where products are inserted in concave sections called “cell” to be processed through a blister-packing machine, and then a unit of those concave sections are heat-pressed onto a board already applied with adhesive and punched out or cut off to be finished. In this approach, however, factors including poor quality of adhesive and inappropriate pressure/temperature have been causing problems such as peeling off. This tester can provide effective solutions for preventing those problems. Dies used with this tester are fabricated according to the shape of the product subject to packaging.
Pressurizing Surface 200×200mm (effective area)
Pressure 1,000 to 1,500N (total pressure)
Temperature max. 150℃
Heater 100V 1kW
Timer max. 30 sec.
Power Source 100/110VAC 50/60Hz 12A
Air Source 0.7MPa
Outer Dimensions 730×420×770mm
Instrument Weight 157kg
